镀铜COPPER PLATING
1. INTRODUCTION 介绍
A. The data in this subject comes from Boeing Process Specification BAC5722. The airline has a copy of the Boeing Process Specification Manual.
本主题中的数据来自波音工艺规范 BAC5722。航空公司有一本波音工艺规范手册。
B. The data is general. It is not about all situations or specific installations. Use this data to help you write minimum standards.
数据是通用的。并不涉及所有情况或特定安装。使用此数据可帮助您编写最低标准。
C. This procedure will make copper plating that agrees with MIL-C-14550. Equivalent procedures can be used.
本程序可制作出符合 MIL-C-14550 标准的电镀铜。可使用同等程序。
D. Do not use this procedure to copper plate steels heat-treated above 220 ksi.
请勿使用本程序对热处理超过 220 ksi 的钢材进行电镀铜。
E. Refer to SOPM 20-00-00 for a list of all the vendor names and addresses.
请参阅 SOPM 20-00-00，了解所有供应商的名称和地址。
2. MATERIALS 材料
A. Copper anodes — QQ-A-673
铜阳极 – QQ-A-673
B. Copper anode, rolled, annealed, or electrolytic
轧制、退火或电解阳极铜
C. Copper carbonate, CuCO3 Cu(OH)2, plating grade
电镀级碳酸铜，CuCO3 Cu(OH)2
D. Copper fluoborate concentrate, 45 percent, plating grade, V70308
氟硼酸铜精矿，45%，电镀级，V70308
E. Cuprous cyanide, 70 percent copper minimum, 0.20 percent insoluble matter maximum, plating grade
氰化亚铜，铜含量最低 70%，不溶物含量最高 0.20%，电镀级
F. Fluoboric acid, 48-50 percent, plating grade
氟硼酸，48-50%，电镀级
G. Sodium cyanide, 97 percent NaCN minimum, plating grade
氰化钠，NaCN 最低含量为 97%，电镀级
H. Sodium hydroxide, flake or granulated, technical — O-S-598
工业级片状或颗粒状氢氧化钠 — O-S-598
I. Sodium carbonate, anhydrous, technical — O-S-571
工业级无水碳酸钠 — O-S-571
J. Rochelle salts (potassium sodium tartrate tetrahydrate), technical
工业用罗谢尔盐（酒石酸钾钠四水合物)
K. Pumice, grade FF
浮石，FF 级
L. Potassium hydroxide, flake or granular
片状或颗粒状氢氧化钾
M. Cupralite Salts, V61539
铜绿石盐，V61539
N. Cupralite Additive No. 10, V61539
10 号铜绿石添加剂，V61539
O. Cupralite Additive No. 20, V61539
20 号铜绿石添加剂，V61539
P. Cupralite Additive No. 24, V61539
24 号亚铜添加剂，V61539
Q. Hydrochloric acid, 20° Baume’, technical
盐酸，20° Baume’，工业级
R. Sulfuric acid, 66° Baume’, technical — O-S-809
工业硫酸，66° 波美度 — O-S-809
S. Chromic acid (chromium trioxide) — O-C-303
铬酸（三氧化二铬） — O-C-303
T. Nitric acid, 40° or 42° Baume’, technical — O-N-350
硝酸，40° 或 42° Baume’，工业用 — O-N-350
U. Sodium dichromate dihydrate, technical — O-S-595
工业用二水重铬酸钠 — O-S-595
V. Inhibitors 抑制剂
(1) Acryl, V61102
(2) Polyrad 1110A, V28284
(3) Rodine 213, V84063
3. SOLUTION PREPARATION 溶液配制
WARNING :THE COPPER PLATING SOLUTIONS CONTAIN CYANIDE AND ARE VERY POISONOUS. DO NOT BREATHE VAPOR OR MIST. DO NOT LET SOLUTIONS TOUCH EYES, SKIN OR CLOTHING. KEEP CYANIDES AWAY FROM HEAT, SPARKS, AND OPEN FLAMES.
警告 :电镀铜溶液含有氰化物，剧毒。切勿吸入蒸气或雾气。不要让溶液接触眼睛、皮肤或衣物。氰化物要远离热源、火花和明火。
A. Inhibited Hydrochloric Acid Solution (BAC5625 Solution 1)
抑制盐酸溶液（BAC5625 溶液 1）
(1) Add approximately 1/10 the total amount of water to the tank.
向槽中加入约为总量 1/10 的水。
(2) Add 54 gallons hydrochloric acid for each 100 gallons final solution.
每 100 加仑最终溶液加入 54 加仑盐酸。
(3) Add 5 pints inhibitor per 100 gallons of final solution. Use only one inhibitor. Do not mix different inhibitors in the same solution.
每 100 加仑最终溶液加入 5 品脱抑制剂。只使用一种抑制剂。不要在同一种溶液中混合不同的抑制剂。
(4) Add water as necessary to fill the tank to the operating level.
根据需要加水，将槽注满至操作水平。
(5) Use this solution at room temperature.
在室温下使用该溶液。
(6) Control the acid concentration at 23-38 oz/gal HCl. Add 1 fluid ounce inhibitor with each gallon hydrochloric acid (that is, 0.8 percent by volume) used to adjust the acid concentration.
控制酸浓度为 23-38 oz/gal盐酸。每加仑盐酸加入 1 液体盎司抑制剂（即 0.8%（体积）），以调整酸浓度。
(7) Metal contamination limits — Iron, 5 oz/gal maximum; copper, 0.5 oz/gal maximum.
金属污染限制 — 铁，最多 5 oz/gal；铜，最多 0.5 oz/gal。
B. Cyanide Holding Bath (BAC5625 Solution 11A)
氰化物保温槽（BAC5625 溶液 11A）
(1) Add approximately 4/5 the total amount of water to the tank.
向槽中加入约总水量的 4/5。
(2) Add 31 pounds of sodium cyanide and 10 pounds of sodium hydroxide for each 100 gallons final solution.
每 100 加仑最终溶液加入 31 磅氰化钠和 10 磅氢氧化钠。
(3) Fill the tank with water to the operating level.
向槽中加水至操作水位。
(4) Control the solution at 4-5 oz/gal sodium cyanide and 1-2 oz/gal sodium hydroxide.
将溶液控制在 4-5 oz/gal氰化钠和 1-2 oz/gal氢氧化钠。
(5) Use this solution at room temperature.
在室温下使用此溶液。
C. Uninhibited Hydrochloric Acid Solution (BAC5625 Solution 19)
无抑制盐酸溶液（BAC5625 溶液 19）
(1) Add approximately 2/3 the total amount of water to the tank.
向槽中加入约总水量的 2/3。
(2) Add 14 gallons hydrochloric acid for each 100 gallons final solution.
每 100 加仑最终溶液加入 14 加仑盐酸。
(3) Add water as necessary to fill the tank to the operating level.
根据需要加水，将槽注满至操作水平。
(4) Use this solution at temperatures from room temperature to 140°F.
溶液使用温度为室温至 140°F。
(5) Metal contamination limits — Iron, 1 oz/gal maximum.
金属污染限值 — 铁，最高 1 oz/gal。
D. High Cyanide Plating Bath
高氰电镀液槽
(1) Fully clean the tank. Then fill the tank with warm water to within 1/3 of the final volume.
充分清洗槽。然后向槽中注入温水，水量不超过最终容量的 1/3。
(2) Add 3 gallons Cupralite Additive No. 20, 15.6 pounds potassium hydroxide, 6.25 pounds sodium cyanide, and 85.0 pounds Cupralite salts. Add 1 gallon Cupralite Additive No. 10 or 7 gallons Cupralite No. 24.
加入 3 加仑 20 号 Cupralite 添加剂、15.6 磅氢氧化钾、6.25 磅氰化钠和 85.0 磅 Cupralite 盐。加入 1 加仑 10 号 Cupralite 添加剂或 7 加仑 24 号 Cupralite 添加剂。
(3) Fill the tank with water to the operating level.
向槽中加水至操作水平。
(4) Control the solution at 0.5-2.5 oz/gal free sodium cyanide, 3.5-9.0 oz/gal copper metal, 2.0-5.0 oz/gal potassium hydroxide, 8.0 oz/gal maximum sodium carbonate. The Cupralite concentration is controlled by the analysis for total copper metal. To increase the copper metal concentration by 1.0 oz/gal, add 3 oz/gal Cupralite salts. Do not try to increase the copper with cuprous cyanide.
将溶液控制在 0.5-2.5 oz/gal游离氰化钠、3.5-9.0 oz/gal金属铜、2.0-5.0 oz/gal氢氧化钾、8.0 oz/gal最大碳酸钠。铜绿石的浓度受金属铜总量分析的控制。若要增加 1.0 oz/gal的铜金属浓度，可添加 3 oz/gal的铜盐。不要尝试用氰化亚铜来增加铜含量。
(5) Control the Cupralite Additive No. 10 concentration by Ball cell or the quality of the copper plating. Add more than 0.2 gallon at a time.
通过球池或电镀铜的质量来控制 10 号 Cupralite 添加剂的浓度。每次添加量不要超过 0.2 加仑。
(6) Control the solution temperature at 120-170°F (150°F is best).
将溶液温度控制在 120-170°F（150°F 最佳）。
E. Copper Strike Solution
镀铜溶液
(1) Fully clean the tank. Then add approximately 3/4 the total amount of water required.
充分清洗槽。然后加入所需水总量的约 3/4。
(2) Add 37 pounds sodium cyanide, and 22 pounds cuprous cyanide per 100 gallons of final solution. Stir until completely dissolved.
每 100 加仑最终溶液加入 37 磅氰化钠和 22 磅亚铜氰化物。搅拌直至完全溶解。
(3) Fill the tank with water to the operating level.
向槽中加水至操作水位。
(4) Control the solution at 2.0-4.0 oz/gal copper metal, 0.5-2.0 oz/gal free sodium cyanide, and 0.1-0.5 oz/gal sodium hydroxide.
将溶液控制在 2.0-4.0 oz/gal金属铜、0.5-2.0 oz/gal游离氰化钠和 0.1-0.5 oz/gal氢氧化钠。
(5) Use this solution at room temperature, or control it at 120-150°F.
在室温下使用此溶液，或控制在 120-150°F.
F. Nitric-Sulfuric Acid Solution
硝酸-硫酸溶液
(1) Put 40 gallons of water in a tank. Add 32 gallons of sulfuric acid and 12 gallons of 40° Baume’ nitric acid or 11 gallons of 42° Baume’ nitric acid per 100 gallons of final solution. Then fill the tank with water to the operating level.
在槽中放入 40 加仑水。每 100 加仑最终溶液加入 32 加仑硫酸和 12 加仑 40° Baume硝酸或 11 加仑 42° Baume硝酸。然后向槽中注水至操作水位。
(2) Control the solution at 50-80 oz/gal sulfuric acid, 10-15 oz/gal nitric acid, and 2.5 oz/gal maximum copper.
将溶液控制在 50-80 oz/gal硫酸、10-15 oz/gal硝酸和最大 2.5 oz/gal铜。
(3) Use this solution at room temperature.
在室温下使用此溶液。
G. Chromic-Sulfuric Acid Solution
铬硫酸溶液
(1) Put 60 gallons water in a tank. Add 25 pounds of chromic acid, and 12 gallons of sulfuric acid per 100 gallons of final solution. Then fill the tank with water to the operating level.
在槽中放入 60 加仑水。每 100 加仑最终溶液加入 25 磅铬酸和 12 加仑硫酸。然后向槽中注水至操作水位。
(2) Control the solution at 3.0-4.0 oz/gal chromic acid, 22-30 oz/gal sulfuric acid, and 2.0 oz/gal maximum copper.
将溶液控制在每加仑铬酸 3.0-4.0 盎司、每加仑硫酸 22-30 盎司、每加仑铜最多 2.0 盎司。
(3) Use this solution at room temperature.
在室温下使用此溶液。
H. Sodium Dichromate – Sulfuric Acid Solution
重铬酸钠-硫酸溶液
(1) Put 60 gallons of water in a tank. Add 33 pounds of sodium dichromate, and 12 gallons of sulfuric acid per 100 gallons of final solution. Then fill the tank with water to the operating level.
在槽中放入 60 加仑水。每 100 加仑最终溶液加入 33 磅重铬酸钠和 12 加仑硫酸。然后向槽中注水至操作水位。
(2) Control the solution at 4.5-6.0 oz/gal sodium dichromate dihydrate, 22-30 oz/gal sulfuric acid and 2.0 oz/gal maximum copper.
将溶液控制在二水重铬酸钠 4.5-6.0 oz/gal，硫酸 22-30 oz/gal，铜最高 2.0 oz/gal。
(3) Use this solution at room temperature.
在室温下使用该溶液。
I. Sulfuric Acid Solution
硫酸溶液
(1) Put 60 gallons of water in a tank. Add 10 gallons of sulfuric acid per 100 gallons of final solution. Then fill the tank with water to the operating level.
在槽中放入 60 加仑水。每 100 加仑最终溶液加入 10 加仑硫酸。然后向槽中注水至操作水位。
(2) Control the solution at 19-26 oz/gal sulfuric acid, and 4 oz/gal maximum copper, except, to treat copper on circuit boards, control the copper at 1 oz/gal maximum.
将溶液控制在 19-26 oz/gal硫酸和 最大4 oz/gal铜，但处理电路板上的铜时，铜的最大控制在 1 oz/gal。
(3) Use this solution at room temperature (100°F maximum).
在室温（最高 100°F）下使用此溶液。
J. Fluoboric Acid Solution
氟硼酸溶液
(1) Put 60 gallons of water in a tank. Add 22 gallons of fluoboric acid per 100 gallons of final solution. Then fill the tank with water to the operating level.
在槽中放入 60 加仑水。每 100 加仑最终溶液加入 22 加仑氟硼酸。然后将水注入槽内至操作水位。
(2) Control the solution at 13-20 oz/gal fluoboric acid, and 1.5 oz/gal maximum copper.
控制溶液的氟硼酸浓度为 13-20 oz/gal，铜的最大浓度为 1.5 oz/gal。
(3) Use this solution at room temperature.
在室温下使用此溶液。
K. Copper Fluoborate Plating Bath
氟硼酸铜电镀液
(1) Put 35 gallons of copper fluoborate concentrate in a tank. Then add 65 gallons of water per 100 gallons of final solution.
将 35 加仑氟硼酸铜浓缩液放入槽中。然后每 100 加仑最终溶液加入 65 加仑水。
(2) Control the pH at 0.8-1.4. Increase the pH with copper carbonate slurry. Decrease the pH with fluoboric acid.
将 pH 值控制在 0.8-1.4 之间。用碳酸铜浆提高 pH 值。用氟硼酸降低 pH 值。
(3) Control solution at 21-24 oz/gal copper fluoborate at 80°F, and 7.5-9.0 oz/gal copper metal.
在 80°F 温度下，将溶液控制在 21-24 oz/gal氟硼酸铜和 7.5-9.0 oz/gal金属铜。
(4) Control the solution temperature at 80-120°F.
将溶液温度控制在 80-120°F。
L. Cyanide-Rochelle Salt solution
氰化物-罗谢尔盐溶液
(1) Fully clean the tank. Then add approximately 3/4 the total amount of water required.
充分清洗槽。然后加入所需水总量的约 3/4。
(2) Add 30 pounds of sodium cyanide and 13 pounds sodium carbonate per 100 gallons final solution. Stir until fully dissolved. Do not let the materials collect as a layer on the bottom of the tank.
每 100 加仑最终溶液加入 30 磅氰化钠和 13 磅碳酸钠。搅拌直至完全溶解。不要让材料在槽底聚集成一层。
(3) Slowly add 22 pounds cuprous cyanide per 100 gallons final solution. Stir constantly until fully dissolved.
每 100 加仑最终溶液缓慢加入 22 磅氰化亚铜。不断搅拌直至完全溶解。
(4) Add 30 pounds Rochelle salts per 100 gallons final solution and stir until fully dissolved.
每 100 加仑最终溶液加入 30 磅Rochelle盐，搅拌至完全溶解。
(5) Fill the tank with water to the operating level.
在槽中加水至操作水平。
(6) Slowly add sodium hydroxide, and stir until the solution pH is 12.2-12.8. This will use approximately 4 pounds per 100 gallons solution.
缓慢加入氢氧化钠，搅拌至溶液 pH 值为 12.2-12.8。每 100 加仑溶液大约需要 4 磅。
(7) Control the solution at 2.0-4.0 oz/gal copper metal, 0.5-2.0 oz/gal free sodium cyanide, 2.0-12.0 oz/gal sodium carbonate, and 4.0-8.0 oz/gal Rochelle salts.
将溶液控制在 2.0-4.0 oz/gal金属铜、0.5-2.0 oz/gal游离氰化钠、2.0-12.0 oz/gal碳酸钠和 4.0-8.0 oz/gal Rochelle盐。
(8) Control the solution at temperature 120-130°F.
将溶液温度控制在 120-130°F。
4. PART PREPARATION 零件准备
A. Surfaces must be water-break-free after they were in any processing solution or rinse except vapor degreasing, solvent cleaning or emulsion cleaning. A water-break-free surface is a surface which keeps a continuous water film for at least 30 seconds after it was spray or immersion rinsed in clean water at a temperature below 100°F. Clean parts again which show exhibit water-breaks.
除蒸气脱脂、溶剂清洗或乳液清洗外，表面在任何加工溶液或冲洗后必须无断水。无断水表面是指在温度低于 100°F的清水中喷淋或浸泡冲洗后，至少 30 秒钟内保持连续水膜的表面。再次清洗出现水纹的零件。
B. Ferrous alloys, nickel alloys, cobalt alloys, and nickel plate.
铁合金、镍合金、钴合金和镍电镀。
(1) Vapor degrease or solvent clean per SOPM 20-30-03.
按 SOPM 20-30-03 标准进行蒸汽脱脂或溶剂清洗。
(2) Before plating, stress relieve per SOPM 20-10-02 all low alloy steel parts.
在电镀前，按照 SOPM 20-10-02 对所有低合金钢零件进行应力消除。
(3) Remove rust and scale per SOPM 20-30-03, if necessary. Then remove smut by one of these 3 procedures:
如有必要，按照 SOPM 20-30-03 进行除锈和除垢。然后用以下 3 种程序之一清除污垢：
(a) Air-water blast or wet abrasive blast per SOPM 20-30-03.
按照 SOPM 20-30-03 进行水气喷砂或湿喷砂。
(b) Glass bead blast per SOPM 20-30-03, if the part is dry.
如果零件干燥，则按照 SOPM 20-30-03 进行玻璃珠喷砂。
(c) Electrolytic reverse clean per SOPM 20-30-03, at a current density of 40-80 ASF for a maximum of 6 minutes. Maximum current density and time are recommended.
按照 SOPM 20-30-03，以 40-80 ASF 的电流密度进行最长 6 分钟的电解反向清洁。建议使用最大电流密度和时间。
(4) Cold water rinse. As an option, a hot water rinse can be used to help dry the parts.
冷水冲洗。可选择使用热水冲洗，以帮助干燥零件。
(5) Mask and rack as necessary.
根据需要遮盖和上架。
(6) Alkaline clean and rinse per SOPM 20-30-03.
按照 SOPM 20-30-03 进行碱性清洁和冲洗。
(7) As an option for parts which will be heat treated, carburized, or nitrided, put the parts in inhibited hydrochloric acid solution for 30-60 seconds. Do not keep the parts in this solution too long, or the solution will etch the surface and cause smut.
对于将进行热处理、渗碳或氮化处理的零件，可将其放入抑制盐酸溶液中 30-60 秒。不要让零件在溶液中停留太长时间，否则溶液会腐蚀表面，造成污垢。
(8) Put all other parts in uninhibited hydrochloric acid solution for 30-60 seconds.
将所有其他零件放入无抑制盐酸溶液中浸泡 30-60 秒。
(9) If the parts have smut, remove it per Paragraph 4.B.(3) above.
如果零件上有污垢，则按照上文第 4.B.(3)段的方法清除污垢。
(10) Rinse for one minute maximum.
最多冲洗一分钟。
(11) For mild and alloy steels, if necessary to stop the procedure temporarily, put the parts in the cyanide holding bath. When you continue, rinse the parts thoroughly in cold water. This rinse is optional if the parts will be plated in a cyanide plating bath.
对于低碳钢和合金钢，如有必要暂时停止程序，将零件放入氰化物保温槽中。继续操作时，用冷水彻底冲洗零件。如果零件将在氰化物电镀槽中电镀，则可选择此冲洗步骤。
(12) For all other ferrous alloys (not the mild and low alloy steels), nickel alloys, cobalt alloys, nickel plating, nickel strike per SOPM 20-42-09.
对于所有其他铁合金（非低碳钢和低合金钢）、镍合金、钴合金、电镀镍，按照 SOPM 20-42-09 进行镍击。
(13) Immediately copper plate per Paragraph 5.
立即按第 5 段进行电镀铜。
C. Aluminum alloys — Prepare the parts, and copper strike, per SOPM 20-42-04.
铝合金 – 按照 SOPM 20-42-04 准备零件和镀铜。
D. Copper and copper alloys — Prepare the parts per Cleaning of Copper and Copper Alloys in SOPM 20-30-03.
铜及铜合金 — 按照 SOPM 20-30-03 中的铜及铜合金清洁要求准备零件。
5. PLATING PROCEDURES 电镀程序
A. Move the parts to the plating tank within two minutes. Do not let the parts dry.
在两分钟内将零件移至电镀槽。不要让零件干燥。
B. For parts to be plated to a thickness of more than 0.001 inch (optional for thickness less than 0.001 inch)
电镀厚度大于 0.001 英寸的零件（厚度小于 0.001 英寸的零件可选择电镀）
(1) Plate in copper strike solution for approximately four minutes at 4-6 volts. This step is not necessary for copper parts given the copper strike per Paragraph 4.D. or for aluminum parts given the copper strike per Paragraph 4.C.
在铜镀液中电镀约四分钟，电压 4-6 伏。对于按第 4.D 段进行镀铜处理的铜质零件或按第 4.C 段进行镀铜处理的铝质零件，无需此步骤。
(2) Rinse.
冲洗。
(3) Copper plate in fluoborate bath, at a current density of 75-125 ASF and a temperature of 80-120°F, to the thickness specified by the overhaul instructions.
在电流密度为 75-125 ASF、温度为 80-120°F的氟硼酸盐电镀液中电镀铜，镀至大修说明规定的厚度。
C. For parts to be plated to a thickness less than 0.001 inch.
电镀厚度小于 0.001 英寸的零件。
(1) Copper plate in cyanide bath, at a current density of 30-60 ASF and a temperature of 120-130°F, to the thickness specified by the overhaul instructions.
在电流密度为 30-60 ASF、温度为 120-130°F的氰化物电镀池中电镀铜板，镀至大修说明规定的厚度。
(2) If thicker plate is required
如需更厚的电镀板
(a) Buff to make the surface finish smoother.
抛光，使表面更光滑。
(b) Alkaline clean and rinse per SOPM 20-30-03.
按照 SOPM 20-30-03 进行碱性清洁和冲洗。
(c) Put the parts in sulfuric acid solution for 15-60 seconds.
将零件放入硫酸溶液中 15-60 秒。
(d) Rinse.
冲洗。
(e) Put the parts in cyanide holding bath.
将零件放入氰化物保温槽中。
(f) Rinse (optional).
冲洗（可选）。
(g) Copper plate per Paragraph 5.C.(1) above.
根据上述第 5.C.(1)段进行电镀铜。
D. Rinse in cold water. A hot water rinse can be used to help dry the parts.
用冷水冲洗。可使用热水冲洗以帮助干燥零件。
E. Dry.
干燥。
F. Post-Plate Bake.
电镀后烘烤。
(1) Ferrous alloy parts.
铁合金零件。
NOTE: Nickel alloys 625 and 718, and corrosion resistant steels 17-7PH (CH-900), A286, and 300 series, do not require this bake.
注： 镍合金 625 和 718 以及耐腐蚀钢 17-7PH (CH-900)、A286 和 300 系列不需要此烘烤。
(a) Carburized parts with core strengths above 180 ksi: 5-8 hours at 250-300°F.
核心强度高于 180 ksi 的渗碳零件：在 250-300°F 下烘烤 5-8 小时。
(b) Threaded parts (unless carburized) 160-220 ksi: 3 hours minimum at 350-400°F.
160-220 ksi 的螺纹零件（渗碳除外）：在 350-400°F 温度下至少 3 小时。
(c) All other ferrous alloy parts 180-220 ksi: 3 hours minimum at 350-400°F.
所有其他 180-220 ksi 的铁合金零件：在 350-400°F下至少 3 小时。
(2) Aluminum parts — Bake 1 hour at 175-225°F, or put the parts in boiling water for 1 hour.
铝质零件 — 在 175-225 华氏度下烘烤 1 小时，或将零件放入沸水中煮 1 小时。
6. QUALITY CONTROL 质量控制
A. The copper plating must be smooth, fine grained, adherent, and have no blisters, pits, nodules, burns, or other defects, or separation when examined without magnification.
电镀铜必须光滑、纹理细腻、附着力强，无水泡、凹坑、结节、烧伤或其他缺陷，不放大检查时无分离现象。
B. On parts other than aluminum, the plating must not come off when tested per BSS 7235.
在铝以外的零件上，电镀层在按照 BSS 7235 测试时不得脱落。
C. When copper plating is applied as a selective stop-off to carburization or nitriding, or to prevent decarburization, plate to a minimum of 0.0008 inch. A thicker layer could be necessary to get the minimum thickness in holes, recesses and other areas which are to be masked from carburization.
当电镀铜作为渗碳或渗氮的选择性阻挡层，或防止脱碳时，电镀层最小为 0.0008 英寸。在孔洞、凹槽和其他需要防止渗碳的区域，可能需要更厚的镀层以达到最小厚度。
D. For all other parts, plate to the thickness specified by the overhaul instructions.
对于所有其他零件，电镀至大修说明规定的厚度。
E. Unless specified by the overhaul instructions or above, the thickness requirements are for only visible surfaces which can be touched by a ball 0.75 inch in diameter. The plating must be continuous on all surfaces touched by the plating current.
除非大修说明或上述规定，厚度要求仅适用于直径 0.75 英寸的球可触及的可见表面。电镀电流触及的所有表面的电镀必须连续。
F. Measure the thickness with a procedure that is accurate to within +/-10 percent.
使用精确度在 +/-10% 范围内的程序测量厚度。